FLIR Hadron™ 640+

Highlights

The FLIR Hadron 640+ is a high-performance dual thermal and visible OEM camera module designed for applications that require improved Boson+ thermal sensitivity, high-resolution visible imaging, and compact SWaP-optimized integration. It combines a 640 x 512 Boson+ LWIR thermal camera with a 64MP visible camera in a lightweight module built for unmanned systems, robotics, inspection platforms, and AI-enabled sensing.

The Hadron 640+ is the non-radiometric Boson+ model in the Hadron 640 series. It provides high-sensitivity thermal imaging with <20 mK thermal sensitivity, plus 64MP electro-optical imaging for machine learning, object detection, navigation, and situational awareness. With shared Hadron 640 series mechanical and electrical interfaces, USB 3.0 / MIPI video output, and support for leading embedded processors, the FLIR Hadron 640+ helps reduce integration complexity and accelerate development.

FLIR Hadron 640+ Features

• Dual thermal and visible OEM camera module for UAS, UGV, robotics, inspection, and AI applications.
• 640 x 512 Boson+ LWIR thermal camera.
• Non-radiometric thermal imaging model.
• Thermal sensitivity: <20 mK.
• 64MP visible camera for high-resolution electro-optical imaging.
• Flexible dual 60 Hz video output through USB or MIPI.
• Compact SWaP-optimized design: 35 x 49 x 45 mm.
• Lightweight 56 g module for payload-sensitive platforms.
• Typical power consumption under 1.8 W; maximum power under 2.9 W.
• Shared mechanical and electrical interfaces with other Hadron 640 models.
• Compatible with Teledyne FLIR Prism™ AI and Prism ISP software tools.
• Software driver support for NVIDIA Jetson Nano, Qualcomm Snapdragon RB5, and Qualcomm Snapdragon 865.
• IP54-rated when rear interfaces are properly sealed.
• ITAR-free and classified under U.S. Department of Commerce jurisdiction as ECCN 6A003.b.4.b.

FLIR Hadron 640+ Applications

• Unmanned aircraft systems (UAS)
• Unmanned ground vehicles (UGV)
• Robotics and autonomous systems
• AI and machine learning vision systems
• Navigation and obstacle awareness
• Security, surveillance, and situational awareness
• Industrial inspection platforms
• Low-light and no-light thermal imaging
• Embedded vision development
• Payload-sensitive imaging systems