EVT Hole & Void Inspector System

Highlights

The EVT Hole & Void Inspector System (HVI) is based on active Thermal Imaging. The HVI can detect concealed holes and voids in diverse materials such as e.g. wood, caoutchouc, plastic, foamed material or fiber-reinforced plastic material, etc. The Ready-to-use systems offer versatile solutions with only a small amount of adjustment and at the push of a few buttons in industries such as food, beverage, electronic as well as areas such as Deep Learning, Thermal Imaging, 2D, and also 3D image processing. The system includes an already preconfigured EyeVision Software solution for free adaption, as well as an EmSys computing hardware and an industrial camera of one of the supported makers such as Allied Vision Technologies, Basler, Baumer, Teledyne Dalsa, or also thermal imaging cameras by Optris or Flir. There are GigE and USB cameras available.

For Active & Passive Thermal Imaging

Active Thermal Imaging means that the object is irradiated with heat. Passive Thermal Imaging means that the object is heated during the production process. Afterward, a thermal imaging camera inspects how the material is cooling down. Holes and voids have different heat flow than the material and can therefore be detected.

EVT Hole & Void Inspector System Features

Interface Protocol

The EVT Hole & Void Inspector System can communicate via the hardware interfaces with a tracker-system as well as with SCADA or a PLC. With the communication protocols such as Profinet, Modbus, TCP/IP & UDP the system can communicate with the machine.

Stand-alone or Headless system

The stand-alone-system is available with a user interface and can be set up locally. The headless system is programmed remotely from the master computer to upgrade already existing facilities. The inspection results can be sent via the integrated webserver to a browser.